Solder Tin Cream Flux Paste No‑Clean for Phone Accessories Soldering 223 RMA‑223‑UV
- The surface tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material.
- The high temperature of soldering is easy to oxidize the surface of the soldering material, and the solder paste helps prevent the oxidation process
- High tin running speed, low emission, and high residual insulation resistance on the surface after curing
- Small size, easy to carry and store, convenient to use and with good performance
- Used in PCB, BGA and PGA SMD rework solder paste and low ion system
