SUNSHINE 158 Degree Melting Pointed BGA IC CPU Solder Paste For Mobile Phone
Place of Origin: Guangdong, China (Mainland)
Brand Name: MECHANIC
Model Number: SP-50
Name: SUNSHINE 158 ℃ BGA CPU Solder Paste
Diameter: 28mm
Weight: 50g
Particle size: 20-38um
Conductivity rate: 14
flux content: 9+-0.5
Viscosity: 178+-10
Feature: low smoke,RoHs solder paste,non-corroding
Melting point: 158 degree
Application: Mobile CPU
